Beyond heat loss the other big way data center losses energy is when moving data around from rack-to-rack and server-to-server. I’ll discuss chip-to-chip solutions later. Networking was always an inefficiency, but frontier models require training across multiple racks and servers within racks and connections need to be high-bandwidth, low-latency, and low-power. The energy cost and time delay associated with moving data between compute nodes can be a significant bottleneck. The primary driver will continue to be for higher-bandwidth and lower latency connections, but if power consumption isn’t addressed networking could end up becoming one of the biggest energy loss components in the datacenter. For rack-to-rack improvements, silicon photonics-based AOCs and polymer optical fibers need to be explored, and for server-to-server it is co-packaged optics and wireless inter-rack communication.

Opportunities

Silicon photonics-based AOCs

Co-packaged optics (CPO)

Wireless inter-rack communication

Others